3D集成电路将如何同时实现？

　　Author Information

　　Philip Garrou consults in the areas of thin-film microelectronics, IC packaging and materials for microelectronics. He was previously global director of technology and new business development of Dow Chemical's Advanced Electronic Materials business. Garrou is a Fellow of IEEE and IMAPS, and has served as president of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and IMAPS. He has a B.S. in chemistry from North Carolina State University and a Ph.D. in chemistry from Indiana University. e-mail: philgarrou@att.net

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